Poly-Elek | electrically conductive compounds

A. Westensee & Partner is your competent partner for electrically conductive compounds. With Poly-Elek ESD, we present an extensive range of permanent antistatic compounds on the market.
All types comply with the conductivity values required in the IEC standard 61340-5-1 and the US standard ANSI / ESD S 20.20.
The requirements of the BfR (German Federal Institute for Risk Assessment) are met in almost all cases. Please ask us.

Information:
ESDS stands for “Electrostatic Sensitive Devices”, e.g. for electrostatically sensitive devices. ESD stands for “Electrostatic Discharge Control”.

The terms electrostatic conductive and dissipative are defined in IEC 61340-5-1 as follows:
electrostatically conductive> 1×10² Ω and < 1×10⁵ Ω electrostatic dissipative>1×10⁵ Ω < 1×10¹¹Ω

US standard ANSI / ESD S 20.20:
electrostatically conductive <1×10⁴ Ω electrostatically dissipative> 1×10⁴ Ω and < 1×10¹¹ Ω Information about electrically conductive compounds: Polymers can be equipped electrically conductive in different ways. The most common method is the use of conductive fillers such as carbon black. Other fillers can be metal powder, metal fiber, metalized fillers or carbon fibers. When using fillers there is a critical point, so called percolation point. When falling below a certain degree of filling, there is a sharp transition from conductive to insulating. For this reason, the use of carbon black filled compounds for the requirements of IEC 61340-5-1 (> 10⁵ and < 10¹¹ Ω) should be considered critical.
The ESD compounds based on IDP / ICP blends are far superior to carbon black and metal fiber filled compounds.
The new Poly-Elek ESD Compounds are based on a blend of an IDP/ICP (inherently dissipative/conductive polymer) and a thermoplastic resin as carrier.
The dissipative property is generated by free ions in the IDP, which are able to move freely along the polymer-chain.
The required mechanical properties of the compound are achieved by blending the carrier resin with the IDP/ICP polymer.
The processing method (injection molding or extrusion) depends on the thermoplastic used in the blend.